Results for AU3301D3(22)
| Part Number | MFG | D/C | Stock | Package | Action |
|---|---|---|---|---|---|
| AU3301D3 | CNNPCHIP/新晶微 | 25+ | 900,000 | S0DN/A323 | |
| AU3301D3 | LITESEMI/厉特半导体 | 23+ | 999,000 | SODN/A323 | |
| AU3301D3 | TSD/泰盛达 | 26+ | 30,000 | SODN/A323 | |
| AU3301D3 | APPLIED POWER/应能微 | 2026+ | 236,600 | SODN/A323 | |
| AU3301D3 | AppliedPower | 23+ | 63,000 | SODN/A323 | |
| AU3301D3 | 江苏应能微 | 25+ | 68,500 | SOD323 | |
| AU3301D3 | Applied/Cnnpchip/新晶微 | 26+ | 954,483 | SODN/A323 | |
| AU3301D3 | LITESEMI/厉特 | 22+ | 30,000 | SODN/A323 | |
| AU3301D3 | APPLIED | 26+ | 111,510 | SOD323 | |
| AU3301D3 | APPLIED POWER/应能微 | 2026+ | 663,300 | SOD323 | |
| AU3301D3 | JGN/ASEMI/台湾金锆 | 25+ | 80,000 | SODN/A323 | |
| AU3301D3 | AppliedPo | 24+ | 66,000 | SODN/A323 | |
| AU3301D3 | TINYSEMI/台半科技 | 25+ | 203,537 | SODN/A323 | |
| AU3301D3 | XINGHEWEI | 25+ | 300,000 | SODN/A323 | |
| AU3301D3 | TSD/泰盛达 | 26+ | 30,000 | SODN/A323 | |
| AU3301D3 | APPLIEDPOWER | 25+ | 83,121 | SODN/A323 | |
| AU3301D3 | NINEZERO | 26+ | 60,600 | SMD | |
| AU3301D3 | AppliedPower | 22+ | 60,600 | SODN/A323 | |
| AU3301D3 | ZXWILL | 2022+ | 52,300 | SODN/A323 | |
| AU3301D3 | PLINGSEMIC/鹏领 | 23+ | 300,000 | SODN/A323 | |
| AU3301D3 | SXSEMIWD | 2026+PB | 900,000 | SODN/A323 | |
| AU3301D3 | TSD/泰盛达 | 26+ | 30,000 | SODN/A323 |
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