Results for B0524P(28)
| Part Number | MFG | D/C | Stock | Package | Action |
|---|---|---|---|---|---|
| B0524P | BORN伯恩 | 24+ | 68,540 | DFNN/A10L | |
| B0524P | CNNPCHIP/新晶微 | 26+ | 335,600 | DFNN/A10L | |
| B0524P | XINGHEWEI | 25+ | 300,000 | DFN2510N/A10L | |
| B0524P | BORN/伯恩半导体 | 2026+ | 236,600 | DFNN/A10L | |
| B0524P | CNNPCHIP/新晶微 | 26+ | 125,671 | DFN2510N/A10L | |
| B0524P | TINYSEMI/台半科技 | 25+ | 125,430 | DFNN/A10L | |
| B0524P | BORN/伯恩半导体 | 25+ | 166,690 | DFNN/A10 | |
| B0524P | BORN/伯恩半导体 | 2026+ | 663,300 | DFNN/A10L | |
| B0524P | JGN/ASEMI/台湾金锆 | 25+ | 231,000 | DFNN/A10L | |
| B0524P | BORN/伯恩半导体 | 25+ | 34,937 | DFNN/A10(2.5x1.0) | |
| B0524P | 信安/AX | 26+ | 30,000 | DFN2510N/A10L | |
| B0524P | BORN/伯恩半导体 | 2022+ | 53,200 | DFNN/A10L | |
| B0524P | BORN/伯恩半导体 | 25+ | 2,960 | DFNN/A10(2.5x1) | |
| B0524P | BORN/伯恩半导体 | 26+ | 70,000 | DFNN/A10L | |
| B0524P | 台产 | 25+ | 61,600 | DFNN/A10L | |
| B0524P | CNNPCHIP/新晶微 | 25+ | 900,000 | DFN2510N/A10L | |
| B0524P | BORN/伯恩半导体 | 25+ | 9,000 | DFNN/A10L | |
| B0524P | BORN伯恩 | 2022+ | 53,200 | DFNN/A10L | |
| B0524P | BOURNS/伯恩斯 | 2106+ | 7,430 | DFNN/A10L | |
| B0524P | BORN/伯恩半导体 | 25+ | 2,916 | DFNN/A10(2.5x1) | |
| B0524P | SXSEMIWD | 2026+PB | 900,000 | DFN10 | |
| B0524P | BORN/伯恩半导体 | 23+ | 3,000 | DFNN/A10L | |
| WRB0524P-3W | MORN | 22+ | 9,500 | DIP | |
| WRB0524P-3W | MORN | 0704+ | 15 | DIP | |
| WRB0524P-3W | MORNSUN/金升阳 | 2021+ | 661 | 1500VDCDCN/ADC(2 | |
| WRB0524P-3W | MORNSUN/金升阳 | 18+ | 5,000 | DIP | |
| WRB0524P-3W | MORNSUN/金升阳 | 24+ | 500 | SMD | |
| WRB0524P-3W | MORNSUN/金升阳 | 26+ | 153 | DIP |
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