Results for BAL(2,422)
| Part Number | MFG | D/C | Stock | Package | Action |
|---|---|---|---|---|---|
| BAL-NRF01D3IC | ST/意法 | 25+ | 6,000 | WLCSP5 | |
| BALF-SPI2-01D3 | ST/意法 | 22+ | 30,000 | N | |
| BALF-SPI2-01D3 | STMICROELECTRONICS | 2023+ | 30 | SMD | |
| BALF-SPI2-01D3 | ST(意法半导体) | 25+ | 5,000 | UFBGA6 | |
| BALF-SPI2-01D3 | ST/意法 | 25+ | 1,089 | UFBGA6 | |
| BALFHB-WL-04D3 | ST/意法半导体 | 25+ | 10,280 | 原厂封装 | |
| BALF-SPI2-01D3 | ST/意法半导体 | 25+ | 11,000 | 原厂封装 | |
| BALF-SPI2-01D3 | ST/意法半导体 | 25+ | 18,000 | FlipChip6 | |
| BALF-SPI2-01D3 | ST/意法半导体 | 26+ | 10,280 | 原厂封装 | |
| BALF-SPI2-01D3 | ST/意法半导体 | 24+ | 6,000 | FlipChip6 | |
| BALF-SPI2-01D3 | ST/意法 | 23+ | 50,000 | UFBGA6 | |
| BALFHB-WL-04D3 | ST/意法半导体 | 25+ | 9,999 | 原厂封装 | |
| BALF-CC25-02D3 | ST/意法半导体 | 24+ | 6,000 | FlipChip4 | |
| BALF-NRF01D3 | ST/意法半导体 | 25+ | 10,280 | 原厂封装 | |
| BALF-SPI2-01D3 | ST(意法) | 23+ | 20,094 | N/A | |
| BALH-0006SMG | Marki | N/A | 300 | N/A | |
| BALF-SPI2-01D3 | ST/意法半导体 | 25+ | 12,700 | FlipChip6 | |
| BALF-NRF01D3 | ST/意法 | 2023+ | 6,895 | WLCSP | |
| BALF-SPI2-01D3 | ST/意法 | 25+ | 90,000 | UFBGA6 | |
| BALF-NRF01D3 | STMICROELECTRONICS | N/A | 100 | N/A | |
| BALF-CC25-02D3 | ST/意法 | 23+ | 10,000 | SMD | |
| BALF-SPI2-01D3 | STM | 22+ | 50,000 | FlipChip 6 bumps [2.10 x 1.55 | |
| BALF-SPI2-01D3 | ST/意法半导体 | 2511 | 16,900 | FlipChip6 | |
| BALF-NRF01D3 | ST/意法半导体 | 25+ | 20,000 | FlipChip5 | |
| BALFHB-WL-04D3 | ST(意法半导体) | 25+ | 5,001 | CSPG8 | |
| BALF-SPI2-01D3 | ST/意法 | 25+ | 1,089 | UFBGA6 | |
| BALFHB-WL-04D3 | ST/意法半导体 | 26+ | 10,280 | 原厂封装 | |
| BALF-CC25-02D3 | STMicroelectronics | 25+ | 22,412 | N/A | |
| BALF-NRF01D3 | ST | 2447 | 100,500 | SMD | |
| BALF-SPI2-01D3 | ST/意法半导体 | 25 | 6,000 | FlipChip6 | |
| BALF-SPI2-01D3 | STM | 23+ | 50,000 | FlipChip 6 bumps [2.10 x 1.55 | |
| BALH-0006SMG | Marki microwave | 24+ | 4,500 | N/A | |
| BALF-SPI2-01D3 | ST(意法) | 25+ | 500,000 | FlipChip | |
| BALF-2690-02D3 | ST/意法 | 22+ | 30,000 | N | |
| BALF-SPI2-01D3 | ST/意法半导体 | 26+ | 60,000 | FlipChip6 | |
| BALF-2690-02D3 | ST/意法半导体 | 2021+ | 1,000 | FlipChip4 | |
| BALFHB-WL-04D3 | STMICRO | 25+ | 12,369 | N/A | |
| BALF-SPI2-01D3 | STMICROELECTRONICS | 24+ | 21 | con | |
| BALF-SPI2-01D3 | ST意法 | 24+ | 8,000 | UFBGA6 | |
| BALF-SPI2-01D3 | STMICROELECTRONICS | N/A | 21 | N/A | |
| BALFHB-WL-04D3 | ST/意法半导体 | 25+ | 10,280 | 原厂封装 | |
| BALF-SPI2-01D3 | ST/意法半导体 | 25+ | 10,280 | 原厂封装 | |
| BALF-NRF01E3IC | ST/意法 | 25+ | 90,000 | LGA6 | |
| BALF-CC25-02D3 | ST/意法半导体 | 24+ | 16,900 | FlipChip4 | |
| BALF-NRF01E3IC | ST/意法 | 23+ | 50,000 | LGA6 | |
| BALF-SPI2-01D3 | ST/意法半导体 | 25+ | 20,000 | FlipChip6 | |
| BALF-SPI2-01D3 | ST/意法半导体 | 25+ | 9,999 | 原厂封装 | |
| BALF-SPI2-01D3 | ST/意法半导体 | 23+ | 16,900 | FlipChip6 | |
| BALFHB-WL-04D3 | ST/意法半导体 | 25+ | 11,000 | 原厂封装 | |
| BALF-SPI2-01D3 | ST/意法 | 2023+ | 2,476 | UFBGA6 |