Results for BAL(2,422)
| Part Number | MFG | D/C | Stock | Package | Action |
|---|---|---|---|---|---|
| BAL-WILC10-01D3 | ST/意法半导体 | 25+ | 30,000 | FlipChip4 | |
| BAL-WILC10-01D3 | ST/意法半导体 | 21+ | 8,080 | FlipChip4 | |
| BAL-UWB-01E3 | ST/意法半导体 | 25+ | 12,700 | CSP6 | |
| BAL-WILC10-01D3 | ST-意法半导体 | 24+25+26+27+ | 9,358 | 信号调节器 | |
| BAL-UWB-01E3 | ST/意法半导体 | 23+ | 6,900 | CSP6 | |
| BAL-WILC10-01D3 | N/A | 2447 | 100,500 | SMD | |
| BAL-UWB-01E3 | ST/意法半导体 | 26+ | 10,280 | 原厂封装 | |
| BAL-WILC10-01D3 | ST/意法半导体 | 25+ | 10,280 | 原厂封装 | |
| BAL-UWB-01E3 | ST/意法半导体 | 25+ | 11,000 | 原厂封装 | |
| BAL-WILC10-01D3 | ST | 26+ | 60,000 | N/A | |
| BAL-WILC10-01D3 | ST/意法半导体 | 25+ | 9,999 | 原厂封装 | |
| BAL-UWB-01E3 | ST/意法半导体 | 2021+ | 2,500 | CSP6 | |
| BAL-WILC10-01D3 | ST/意法半导体 | 25 | 6,000 | FlipChip4 | |
| BAL-WILC10-01D3 | ST/意法半导体 | 2021+ | 6,900 | FlipChip4 | |
| BAL-UWB-01E3 | ST/意法半导体 | 25+ | 10,280 | 原厂封装 | |
| BAL-WILC10-01D3 | ST/意法半导体 | 25+ | 12,700 | FlipChip4 | |
| BAL-WILC10-01D3 | ST | 2511 | 16,900 | 原厂原封 | |
| BAL-WILC10-01D3 | ST/意法半导体 | 24+ | 6,000 | FlipChip4 | |
| BAL-WILC10-01D3 | ST/意法半导体 | 26+ | 10,280 | 原厂封装 | |
| BAL-WILC10-01D3 | ST/意法半导体 | 26+ | 8,880 | FlipChip4 | |
| BAL-NRF01D3其他IC | ST/意法 | 23+ | 1,200 | WLCSP | |
| BAL-NRF01D3其他IC | ST/意法 | 24+ | 39,197 | WLCSP | |
| BAL-NRF01D3工控元件 | ST/意法 | 24+ | 30,000 | WLCSP5 | |
| BAL-NRF01D3其他IC | ST/意法 | 23+ | 50,000 | WLCSP | |
| BAL-NRF01D3工控元件 | ST/意法 | 1636+ | 3,883 | WFBGA | |
| BAL-NRF01D3工控元件 | ST/意法 | 23+ | 590 | QFN | |
| BAL-NRF01D3工控元件 | ST/意法 | 23+ | 50,000 | QFN | |
| BAL6686 | ROHM | 22+ | 8,000 | DIP | |
| BAL6686 | ROHM | 24+ | 3,010 | ZIP | |
| BAL6686 | ROHM | 23+ | 7,300 | QFP | |
| BAL6686 | ROHM | 24+ | 35,200 | ZIP | |
| BAL6686 | ROHM | 24+ | 21,322 | SIP | |
| BAL6686 | ROHM | 25+ | 66,880 | N/A | |
| BAL6309 | ROHM | 22+ | 8,000 | SIP | |
| BAL6309 | ROHM | 23+ | 7,300 | SIP | |
| BAL6309 | ROHM | 24+ | 36,500 | SIP | |
| BAL66R | ROHM | 23+ | 7,300 | SOP8 | |
| BAL66R | ROHM | 24+ | 36,500 | SOP8 | |
| BALF-NRF01E3 | STMicroelectronics | 23+ | 12,800 | TO18 | |
| BALF-NRF01E3 | ST/意法 | 25+ | 30,000 | LGA61.50x1.00x0.48m | |
| BALF-NRF01E3 | ST(意法半导体) | 25+ | 5,000 | WLCSP6 | |
| BAL690D7 | MICRONE/微盟 | 23+ | 60,000 | DIP7 | |
| BAL74,215 | Nexperia | 26+ | 100,000 | Modules | |
| BAL74E6327 | Infineon(英飞凌) | 25+ | 22,412 | N/A | |
| BAL74E6327 | Infineon(英飞凌) | 25+ | 22,412 | N/A | |
| BAL74E6327 | INFINEON/英飞凌 | 20+ | 120,000 | SOT23 | |
| BAL74 | 恩XP | 24+ | 19,048 | 标准封装 | |
| BAL74 | 恩XP | 24+ | 6,000 | N/A | |
| BAL74 | SMD | 23+ | 15,659 | N/A | |
| BAL74 | Infineon | 24+ | 3,000 | N/A |