Results for BESDL0402-05(26)
| Part Number | MFG | D/C | Stock | Package | Action |
|---|---|---|---|---|---|
| BESDL0402-05 | BOURNS/伯恩斯 | 26+ | 150,000 | SMD0402 | |
| BESDL0402-05 | JGN/ASEMI/台湾金锆 | 25+ | 231,000 | SMD0402 | |
| BESDL0402-05 | BORN/伯恩半导体 | 20+ | 10,000 | 0402 | |
| BESDL0402-05 | BORN/伯恩半导体 | 2026+ | 236,600 | 0402 | |
| BESDL0402-05 | BORN/伯恩半导体 | 24+25+ | 100,000 | 0201/0402/0603 | |
| BESDL0402-05 | ELECSUPER/静芯微 | 25+ | 33,000 | D0402 | |
| BESDL0402-05 | BOURNS/伯恩斯 | 2022+ | 52,300 | D0402 | |
| BESDL0402-05 | 芯科联 | 26+ | 154,000 | 0402 | |
| BESDL0402-05 | TINYSEMI/台半科技 | 25+ | 239,929 | 0402 | |
| BESDL0402-05 | BORN/伯恩半导体 | 2322+ | 20,000 | SMD0402 | |
| BESDL0402-05 | BORN/伯恩半导体 | N/A | 10,000 | N/A | |
| BESDL0402-05 | BOURNS/伯恩斯 | 23+ | 900,000 | D0402 | |
| BESDL0402-05 | BORN/伯恩半导体 | 2026+ | 663,300 | 0402 | |
| BESDL0402-05 | BOURNS/伯恩斯 | 23+ | 999,000 | D0402 | |
| BESDL0402-05 | XINGHEWEI | 25+ | 300,000 | 0402 | |
| BESDL0402-05 | BORN/Cnnpchip/新晶微 | 26+ | 953,000 | C0402 | |
| BESDL0402-05 | YAGEO/国巨 | 25+ | 97,000 | SMD | |
| BESDL0402-05 | BORN/伯恩半导体 | 25+ | 83,121 | SMD0402 | |
| BESDL0402-05 | QDON/启迪半导体 | 25+ | 381,081 | 0402 | |
| BESDL0402-05 | BORN伯恩 | 24+ | 60,000 | 0201/0402/0603 | |
| BESDL0402-05 | SXSEMIWD瞬芯 | 2025+PB | 900,000 | D0402 | |
| BESDL0402-05 | BORN/伯恩半导体 | 25+ | 120,000 | SMD0402 | |
| BESDL0402-05 | BORN/伯恩半导体 | 2322+ | 20,000 | SMD0402 | |
| BESDL0402-05 | BOURNS/伯恩斯 | 2026+PB | 900,000 | D0402 | |
| BESDL0402-05 | BORN/伯恩半导体 | 26+ | 112,500 | SMD0402 | |
| BESDL0402-05 | CNNPCHIP/新晶微 | 26+ | 335,600 | DFN1006 |
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