Results for BESDL0402-24(20)
| Part Number | MFG | D/C | Stock | Package | Action |
|---|---|---|---|---|---|
| BESDL0402-24 | BORN/Cnnpchip/新晶微 | 26+ | 900,000 | C0402 | |
| BESDL0402-24 | SXSEMIWD瞬芯 | 2025+PB | 900,000 | D0402 | |
| BESDL0402-24 | BORN/伯恩半导体 | 25+ | 1,000,000 | SMD2 | |
| BESDL0402-24 | NINEZERO | 26+ | 60,600 | SMD | |
| BESDL0402-24 | XINGHEWEI | 25+ | 300,000 | 0402 | |
| BESDL0402-24 | LITESEMI/厉特 | 23+ | 999,000 | D0402 | |
| BESDL0402-24 | BORN/伯恩半导体 | 24+25+ | 100,000 | 0201/0402/0603 | |
| BESDL0402-24 | QDON/启迪半导体 | 25+ | 381,086 | 0402 | |
| BESDL0402-24 | BORN/伯恩半导体 | 2026+ | 663,300 | 0402 | |
| BESDL0402-24 | JGN/ASEMI/台湾金锆 | 25+ | 231,000 | SMD0402 | |
| BESDL0402-24 | ZXWILL | 2022+ | 52,300 | D0402 | |
| BESDL0402-24 | BORN/伯恩半导体 | 25+ | 83,121 | SMD0402 | |
| BESDL0402-24 | BORN/伯恩半导体 | 2026+ | 236,600 | 0402 | |
| BESDL0402-24 | BOURNS/伯恩斯 | 26+ | 158,000 | SMD0402 | |
| BESDL0402-24 | PLINGSEMIC/鹏领 | 23+ | 300,000 | D0402 | |
| BESDL0402-24 | BORN/伯恩半导体 | 26+ | 111,400 | SMD0402 | |
| BESDL0402-24 | TINYSEMI/台半科技 | 25+ | 233,145 | 0402 | |
| BESDL0402-24 | SXSEMIWD | 2026+PB | 900,000 | D0402 | |
| BESDL0402-24 | 伯恩 | 2511+ | 350,000 | ESD0402 | |
| BESDL0402-24 | BORN伯恩 | 24+ | 60,000 | 0201/0402/0603 |
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