Results for BESDL0603-18(17)
| Part Number | MFG | D/C | Stock | Package | Action |
|---|---|---|---|---|---|
| BESDL0603-18 | BORN/伯恩半导体 | 26+ | 111,550 | SMD0603 | |
| BESDL0603-18 | JGN/ASEMI/台湾金锆 | 25+ | 231,000 | SMD0603 | |
| BESDL0603-18 | SXSEMIWD | 2026+PB | 900,000 | D0603 | |
| BESDL0603-18 | QDON/启迪半导体 | 25+ | 381,091 | 0603 | |
| BESDL0603-18 | SK/森浦科 | 24+ | 39,587 | SMD0603 | |
| BESDL0603-18 | LITESEMI/厉特半导体 | 23+ | 999,000 | D0603 | |
| BESDL0603-18 | CNNPCHIP/新晶微 | 26+ | 335,600 | DFN0603 | |
| BESDL0603-18 | BORN/伯恩半导体 | 25+ | 100,000 | SOD523(0603) | |
| BESDL0603-18 | BORN/伯恩半导体 | 20+ | 855 | SOD523 | |
| BESDL0603-18 | TINYSEMI/台半科技 | 25+ | 128,645 | 0603 | |
| BESDL0603-18 | BORN伯恩 | 24+ | 60,000 | 0201/0402/0603 | |
| BESDL0603-18 | BORN/伯恩半导体 | 24+25+ | 100,000 | 0201/0402/0603 | |
| BESDL0603-18 | BORN/Cnnpchip/新晶微 | 26+ | 120,043 | C0603 | |
| BESDL0603-18 | PLINGSEMIC/鹏领 | 23+ | 300,000 | D0603 | |
| BESDL0603-18 | BORN/伯恩半导体 | 23+ | 60,000 | SMD0603 | |
| BESDL0603-18 | ZXWILL | 2022+ | 52,300 | D0603 | |
| BESDL0603-18 | BORN/伯恩半导体 | 25+ | 189,000 | SMD0603 |
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