Results for BESDU0402-18(13)
| Part Number | MFG | D/C | Stock | Package | Action |
|---|---|---|---|---|---|
| BESDU0402-18 | BORN/伯恩半导体 | 25+ | 83,121 | SMD0402 | |
| BESDU0402-18 | XINGHEWEI | 25+ | 300,000 | C0402 | |
| BESDU0402-18 | SXSEMIWD | 2026+PB | 900,000 | D0402 | |
| BESDU0402-18 | QDON/启迪半导体 | 25+ | 381,097 | 0402 | |
| BESDU0402-18 | JGN/ASEMI/台湾金锆 | 25+ | 231,000 | SMD0402 | |
| BESDU0402-18 | BORN/Cnnpchip/新晶微 | 26+ | 953,000 | C0402 | |
| BESDU0402-18 | CNNPCHIP/新晶微 | 26+ | 335,600 | DFN1006 | |
| BESDU0402-18 | BORN/伯恩半导体 | 26+ | 186,620 | SMD0402 | |
| BESDU0402-18 | TINYSEMI/台半科技 | 25+ | 231,581 | 0402 | |
| BESDU0402-18 | BORN伯恩 | 24+ | 60,000 | 0201/0402/0603 | |
| BESDU0402-18 | BORN/伯恩半导体 | 2026+ | 663,300 | 0402 | |
| BESDU0402-18 | ZXWILL | 2022+ | 52,300 | D0402 | |
| BESDU0402-18 | BORN/伯恩半导体 | 24+25+ | 100,000 | 0201/0402/0603 |
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