Results for BESDU0603-05(20)
| Part Number | MFG | D/C | Stock | Package | Action |
|---|---|---|---|---|---|
| BESDU0603-05 | BORN伯恩 | 24+ | 60,000 | 0201/0402/0603 | |
| BESDU0603-05 | BORN/伯恩半导体 | N/A | 2,000 | N/A | |
| BESDU0603-05 | SXSEMIWD | 2026+PB | 900,000 | D0603 | |
| BESDU0603-05 | JGN/ASEMI/台湾金锆 | 25+ | 231,000 | SMD0603 | |
| BESDU0603-05 | BORN伯恩 | 25+ | 189,000 | SMD0603 | |
| BESDU0603-05 | QDON/启迪半导体 | 25+ | 381,099 | 0603 | |
| BESDU0603-05 | BORN/伯恩半导体 | 25+ | 3,991 | 0603 | |
| BESDU0603-05 | TINYSEMI/台半科技 | 24+ | 215,810 | 0603 | |
| BESDU0603-05 | BORN/伯恩半导体 | 23+ | 1 | 0603 | |
| BESDU0603-05 | BORN/Cnnpchip/新晶微 | 26+ | 122,176 | C0603 | |
| BESDU0603-05 | BORN/伯恩半导体 | 19+ | 4,000 | SMD0603 | |
| BESDU0603-05 | BORN/伯恩半导体 | 24+25+ | 100,000 | 0201/0402/0603 | |
| BESDU0603-05 | BORN/伯恩半导体 | 2026+ | 236,600 | 0603 | |
| BESDU0603-05 | BORN/伯恩半导体 | 2026+ | 663,300 | 0603 | |
| BESDU0603-05 | WILLSEMI/韦尔 | N/A | 51,000 | 0603 | |
| BESDU0603-05 | SK/森浦科 | 24+ | 37,913 | SMD0603 | |
| BESDU0603-05 | BORN/伯恩半导体 | 26+ | 182,600 | SMD0603 | |
| BESDU0603-05 | XINGHEWEI | 25+ | 300,000 | C0603 | |
| BESDU0603-05 | BORN/伯恩半导体 | 23+ | 57,000 | SMD0603 | |
| BESDU0603-05 | CNNPCHIP/新晶微 | 2026 | 335,600 | DFN0603 |
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