Results for BST23A032V(26)
| Part Number | MFG | D/C | Stock | Package | Action |
|---|---|---|---|---|---|
| BST23A032V | TSD/泰盛达 | 26+ | 30,000 | SOTN/A23 | |
| BST23A032V | WILLSEMI/韦尔 | N/A | 51,000 | SOTN/A23 | |
| BST23A032V | BORN/Cnnpchip/新晶微 | 26+ | 123,183 | SOTN/A23 | |
| BST23A032V | JGN/ASEMI/台湾金锆 | 25+ | 231,000 | SOTN/A23 | |
| BST23A032V | LITESEMI/厉特半导体 | 23+ | 999,000 | SOT23 | |
| BST23A032V | SK/森浦科 | 24+ | 36,487 | SOTN/A23 | |
| BST23A032V | BORN/伯恩半导体 | 26+ | 154,450 | SOTN/A23 | |
| BST23A032V | TINYSEMI/台半科技 | 24+ | 107,040 | SOTN/A23 | |
| BST23A032V | LITESEMI/厉特 | 22+ | 30,000 | SOT23 | |
| BST23A032V | BORN/伯恩半导体 | 24+ | 48,000 | SOTN/A23 | |
| BST23A032V | CNNPCHIP/新晶微 | 25+ | 900,000 | SOTN/A23 | |
| BST23A032V | BORN/伯恩半导体 | 25+ | 189,000 | SOTN/A23 | |
| BST23A032V | XINGHEWEI | 25+ | 300,000 | SOTN/A23 | |
| BST23A032V | TSD/泰盛达 | 26+ | 30,000 | SOTN/A23 | |
| BST23A032V | TEN/AONG/拓能 | 2025+ | 1,803,000 | SOTN/A23 | |
| BST23A032V | BORN/伯恩半导体 | 2026+ | 663,300 | SOTN/A23 | |
| BST23A032V | CNNPCHIP/新晶微 | 26+ | 6,000 | SOTN/A23 | |
| BST23A032V | SXSEMIWD | 2026+PB | 900,000 | SOT23 | |
| BST23A032V | 国产 | 25+ | 180,000 | SOTN/A23 | |
| BST23A032V | BORN伯恩 | 24+ | 60,000 | SOTN/A23 | |
| BST23A032V | ELECSUPER/静芯微 | 25+ | 150,000 | SOTN/A23 | |
| BST23A032V | BORN/伯恩半导体 | 24+25+ | 100,000 | SOTN/A23 | |
| BST23A032V | BORN/伯恩半导体 | 23+ | 3,000 | SOTN/A23 | |
| BST23A032V | TSD/泰盛达 | 26+ | 30,000 | SOTN/A23 | |
| BST23A032V | ZXWILL | 2022+ | 52,300 | SOTN/A23 | |
| BST23A032V | PLINGSEMIC/鹏领 | 23+ | 300,000 | SOT23 |
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