Results for BST23C052V(30)
| Part Number | MFG | D/C | Stock | Package | Action |
|---|---|---|---|---|---|
| BST23C052V | TEN/AONG/拓能 | 2025+ | 1,803,000 | SOTN/A23 | |
| BST23C052V | TAYCHIPST/台芯 | 26+ | 30,000 | SOTN/A23 | |
| BST23C052V | BORN伯恩 | 24+ | 60,000 | SOTN/A23 | |
| BST23C052V | MSV/萌盛微 | 26+ | 500,000 | SOT23 | |
| BST23C052V | CNNPCHIP/新晶微 | 26+ | 124,446 | SOTN/A23 | |
| BST23C052V | BORN/伯恩半导体 | 24+ | 78,000 | SOTN/A23 | |
| BST23C052V | BORN/伯恩半导体 | 2026+ | 663,300 | SOTN/A23 | |
| BST23C052V | SK/森浦科 | 24+ | 37,051 | SOTN/A23 | |
| BST23C052V | UMW/广东友台半导体 | 25+ | 1,000,000 | SOTN/A23 | |
| BST23C052V | BORN/伯恩半导体 | 24+25+ | 100,000 | SOTN/A23 | |
| BST23C052V | BORN/伯恩半导体 | 2026+ | 236,600 | SOTN/A23 | |
| BST23C052V | JGN/ASEMI/台湾金锆 | 26+ | 50,000 | SOTN/A23 | |
| BST23C052V | UMW/广东友台半导体 | 25+ | 517,936 | SOTN/A23 | |
| BST23C052V | TSD/泰盛达 | 26+ | 30,000 | SOTN/A23 | |
| BST23C052V | UMW/广东友台半导体 | 25+ | 68,428 | SOTN/A23 | |
| BST23C052V | UMW/广东友台半导体 | 24+ | 40,000 | SOTN/A23 | |
| BST23C052V | BORN/伯恩半导体 | 25+ | 1,000,000 | SOTN/A23 | |
| BST23C052V | XINGHEWEI | 25+ | 300,000 | SOTN/A23 | |
| BST23C052V | BORN伯恩 | 25+ | 189,500 | SOTN/A23 | |
| BST23C052V | UMW/广东友台半导体 | 25+ | 300,000 | SOTN/A23 | |
| BST23C052V | CNNPCHIP/新晶微 | 25+ | 900,000 | SOTN/A23 | |
| BST23C052V | ELECSUPER/静芯微 | 25+ | 78,000 | SOTN/A23 | |
| BST23C052V | BORN/伯恩半导体 | 26+ | 152,190 | SOTN/A23 | |
| BST23C052V | WENETE/韦能特 | 25+ | 120,000 | SOT23 | |
| BST23C052V | SXSEMIWD | 2026+PB | 900,000 | SOT23 | |
| BST23C052V | BOURNS/伯恩斯 | 26+ | 342,564 | SOTN/A23 | |
| BST23C052V | TINYSEMI/台半科技 | 25+ | 111,230 | SOTN/A23 | |
| BST23C052V | UMW/广东友台半导体 | 25+ | 44,860 | SOTN/A23 | |
| BST23C052V | BORN伯恩 | 2022+ | 40,000 | SOT23 | |
| BST23C052V | LIGO SEMICONDUCTOR | 25+ | 150,000 | SOTN/A23 |
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