Results for BST23C122V(30)
| Part Number | MFG | D/C | Stock | Package | Action |
|---|---|---|---|---|---|
| BST23C122V | ELECSUPER/静芯微 | 25+ | 120,000 | SOTN/A23 | |
| BST23C122V | BORN/伯恩半导体 | 25+ | 111,000 | SOTN/A23 | |
| BST23C122V | UMW/广东友台半导体 | 25+ | 44,860 | SOTN/A23 | |
| BST23C122V | BORN/Cnnpchip/新晶微 | 26+ | 123,187 | SOTN/A23 | |
| BST23C122V | BORN伯恩 | 24+ | 60,000 | SOTN/A23 | |
| BST23C122V | UMW/广东友台半导体 | 24+ | 40,000 | SOTN/A23 | |
| BST23C122V | CNNPCHIP/新晶微 | 26+ | 6,345,642 | SOTN/A23 | |
| BST23C122V | SXSEMIWD | 2026+PB | 900,000 | SOT23 | |
| BST23C122V | BORN/伯恩半导体 | 2026+ | 236,600 | SOTN/A23 | |
| BST23C122V | TINYSEMI/台半科技 | 25+ | 102,113 | SOTN/A23 | |
| BST23C122V | TAYCHIPST/台芯 | 26+ | 30,000 | SOTN/A23 | |
| BST23C122V | UMW/广东友台半导体 | 25+ | 101,068 | SOTN/A23 | |
| BST23C122V | XINGHEWEI | 25+ | 300,000 | SOTN/A23 | |
| BST23C122V | JGN/ASEMI/台湾金锆 | 25+ | 231,000 | SOTN/A23 | |
| BST23C122V | UMW/广东友台半导体 | 25+ | 300,000 | SOTN/A23 | |
| BST23C122V | TEN/AONG/拓能 | 2025+ | 1,803,000 | SOTN/A23 | |
| BST23C122V | UMW/广东友台半导体 | 25+ | 1,000,000 | SOTN/A23 | |
| BST23C122V | TSD/泰盛达 | 26+ | 30,000 | SOTN/A23 | |
| BST23C122V | BORN/伯恩半导体 | 24+25+ | 100,000 | SOTN/A23 | |
| BST23C122V | BORN伯恩 | 2022+ | 40,000 | SOT23 | |
| BST23C122V | BORN/伯恩半导体 | 26+ | 121,580 | SOTN/A23 | |
| BST23C122V | 伯恩/NFSY | 2023+ | 60,000 | SOT23 | |
| BST23C122V | BOURNS/伯恩斯 | 22+ | 53,010 | SOTN/A23 | |
| BST23C122V | BORN/伯恩半导体 | 24+ | 69,000 | SOTN/A23 | |
| BST23C122V | CNNPCHIP/新晶微 | 25+ | 900,000 | SOTN/A23 | |
| BST23C122V | BORN/伯恩半导体 | 25+ | 1,000,000 | SOTN/A23 | |
| BST23C122V | WENETE/韦能特 | 25+ | 120,000 | SOT23 | |
| BST23C122V | BORN/伯恩半导体 | 2026+ | 663,300 | SOTN/A23 | |
| BST23C122V | LIGO SEMICONDUCTOR | 25+ | 150,000 | SOTN/A23 | |
| BST23C122V | MSV/萌盛微 | 26+ | 500,000 | SOT23 |
左右滑动查看更多信息