Results for CG0603MLA-18KE(29)
| Part Number | MFG | D/C | Stock | Package | Action |
|---|---|---|---|---|---|
| CG0603MLA-18KE | BOURNS/伯恩斯 | 25+ | 154,611 | SMD | |
| CG0603MLA-18KE | BOURNS/伯恩斯 | 2026+ | 236,600 | 0603 | |
| CG0603MLA-18KE | BOURNS/伯恩斯 | 25+ | 168,000 | SMD | |
| CG0603MLA-18KE | BOURNS/伯恩斯 | 0627+ | 116,000 | N/A | |
| CG0603MLA-18KE | BOURNS/伯恩斯 | 25+ | 435,600 | SMD | |
| CG0603MLA-18KE | BOURNS/伯恩斯 | 25+ | 154,611 | SMD | |
| CG0603MLA-18KE | BOURNS/伯恩斯 | 2021+ | 82,800 | SMD | |
| CG0603MLA-18KE | BOURNS/伯恩斯 | 25+ | 98,070 | SMD | |
| CG0603MLA-18KE | BOURNS/伯恩斯 | 2448+ | 90,500 | SMD | |
| CG0603MLA-18KE | BOURNS/伯恩斯 | 25+ | 84,000 | SMD | |
| CG0603MLA-18KE | XINGHEWEI | 25+ | 300,000 | C0603 | |
| CG0603MLA-18KE | BOURNS/伯恩斯 | 26+ | 111,695 | C0603 | |
| CG0603MLA-18KE | TINYSEMI/台半科技 | 25+ | 200,000 | 0603 | |
| CG0603MLA-18KE | CNNPCHIP/新晶微 | 26+ | 611,400 | C0603 | |
| CG0603MLA-18KE | BOURNS/伯恩斯 | 24+ | 88,000 | 0603 | |
| CG0603MLA-18KE | BOURNS/伯恩斯 | 2025+ | 160,000 | SMD | |
| CG0603MLA-18KE | Semiteh elec | 25+ | 867,326 | 603 | |
| CG0603MLA-18KE | BOURNS/伯恩斯 | 25+ | 330,000 | SMD | |
| CG0603MLA-18KE | BOURNS/伯恩斯 | 2026+ | 663,300 | 0603 | |
| CG0603MLA-18KE | BOURNS/伯恩斯 | 24+ | 120,000 | SMD | |
| CG0603MLA-18KE | QDON/启迪半导体 | 25+ | 380,765 | 0603 | |
| CG0603MLA-18KE | BOURNS/伯恩斯 | 18+ | 260,000 | SMD | |
| CG0603MLA-18KE | BOURNS/伯恩斯 | 2025+ | 120,000 | SMD | |
| CG0603MLA-18KE | BOURNS/伯恩斯 | 25+ | 240,000 | SMD | |
| CG0603MLA-18KE | BOURNS/伯恩斯 | 2023+ | 200,000 | 0603N/AESD | |
| CG0603MLA-18KE | BOURNS/伯恩斯 | 2025+PB | 900,000 | D0603 | |
| CG0603MLA-18KE | BOURNS/伯恩斯 | 2022+ | 265,000 | 0603L | |
| CG0603MLA-18KE | BOURNS/伯恩斯 | 2023+ | 351,054 | SMD | |
| CG0603MLA-18KE | BOURNS/伯恩斯 | 23+ | 999,000 | D0603 |
左右滑动查看更多信息