Results for CG0603MLC-12LEA(30)
| Part Number | MFG | D/C | Stock | Package | Action |
|---|---|---|---|---|---|
| CG0603MLC-12LEA | BOURNS/伯恩斯 | 1534 | 675,000 | SMD | |
| CG0603MLC-12LEA | QDON/启迪半导体 | 25+ | 380,770 | 0603 | |
| CG0603MLC-12LEA | BOURNS/伯恩斯 | 2023+ | 351,054 | SMD | |
| CG0603MLC-12LEA | BOURNS/伯恩斯 | 25+ | 79,020 | SMD | |
| CG0603MLC-12LEA | BOURNS/伯恩斯 | 25+ | 23,000 | SMD | |
| CG0603MLC-12LEA | BOURNS/伯恩斯 | 2025+ | 42,800 | N/A | |
| CG0603MLC-12LEA | BOURNS/伯恩斯 | 2016+ | 374,000 | SMD | |
| CG0603MLC-12LEA | BOURNS/伯恩斯 | 25+ | 240,000 | SMD | |
| CG0603MLC-12LEA | BOURNS/伯恩斯 | 25+ | 435,600 | SMD | |
| CG0603MLC-12LEA | BOURNS/伯恩斯 | 25+ | 200,000 | SMD | |
| CG0603MLC-12LEA | BOURNS/伯恩斯 | 24+ | 88,000 | 0603 | |
| CG0603MLC-12LEA | BOURNS/伯恩斯 | 19+ | 30,000 | SMD | |
| CG0603MLC-12LEA | BOURNS/伯恩斯 | NEW | 2,400,000 | SMD0603 | |
| CG0603MLC-12LEA | BOURNS/伯恩斯 | 24+ | 80,000 | SMD | |
| CG0603MLC-12LEA | BOURNS/伯恩斯 | 2025+ | 100,000 | SMD | |
| CG0603MLC-12LEA | BOURNS/伯恩斯 | 25+ | 48,000 | SMD | |
| CG0603MLC-12LEA | BOURNS/伯恩斯 | 2025+ | 220,000 | SMD | |
| CG0603MLC-12LEA | BOURNS/伯恩斯 | 2448+ | 90,500 | SMD | |
| CG0603MLC-12LEA | BOURNS/伯恩斯 | 2026+ | 663,300 | 0603 | |
| CG0603MLC-12LEA | BOURNS/伯恩斯 | 26+ | 158,000 | SMD0603 | |
| CG0603MLC-12LEA | XINGHEWEI | 25+ | 300,000 | C0603 | |
| CG0603MLC-12LEA | CNNPCHIP/新晶微 | 26+ | 335,600 | C0603 | |
| CG0603MLC-12LEA | BOURNS/伯恩斯 | 25+ | 44,990 | SMD | |
| CG0603MLC-12LEA | BOURNS/伯恩斯 | 25+ | 23,000 | SMD | |
| CG0603MLC-12LEA | Semiteh elec | 25+ | 867,520 | 603 | |
| CG0603MLC-12LEA | BOURNS/伯恩斯 | 25+ | 154,611 | SMD | |
| CG0603MLC-12LEA | TINYSEMI/台半科技 | 25+ | 120,658 | 0603 | |
| CG0603MLC-12LEA | BOURNS/伯恩斯 | 2024+ | 100,000 | SMD | |
| CG0603MLC-12LEA | BOURNS/伯恩斯 | 2026+ | 236,600 | 0603 | |
| CG0603MLC-12LEA | BOURNS/伯恩斯 | 25+ | 154,611 | SMD |
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