Results for CG0603MLC-24LEA(29)
| Part Number | MFG | D/C | Stock | Package | Action |
|---|---|---|---|---|---|
| CG0603MLC-24LEA | BOURNS/伯恩斯 | 25+ | 200,000 | SMD | |
| CG0603MLC-24LEA | EPCOS/爱普科斯 | 23+ | 999,000 | SMD | |
| CG0603MLC-24LEA | BOURNS/伯恩斯 | 2025+ | 280,000 | SMD | |
| CG0603MLC-24LEA | BOURNS/伯恩斯 | 2448+ | 90,500 | SMD | |
| CG0603MLC-24LEA | BOURNS/伯恩斯 | 24+ | 88,000 | 0603 | |
| CG0603MLC-24LEA | BOURNS/伯恩斯 | 2024+ | 100,000 | SMD | |
| CG0603MLC-24LEA | BOURNS/伯恩斯 | 2016+ | 366,000 | SMD | |
| CG0603MLC-24LEA | BOURNS/伯恩斯 | 25+ | 44,990 | SMD | |
| CG0603MLC-24LEA | Semiteh elec | 26+ | 867,521 | 603 | |
| CG0603MLC-24LEA | BOURNS/伯恩斯 | 25+ | 89,080 | SMD | |
| CG0603MLC-24LEA | LITESEMI/厉特 | 22+ | 30,000 | SMD | |
| CG0603MLC-24LEA | XINGHEWEI | 25+ | 300,000 | C0603 | |
| CG0603MLC-24LEA | EPCOS/爱普科斯 | 2026+PB | 900,000 | SMD | |
| CG0603MLC-24LEA | TINYSEMI/台半科技 | 25+ | 120,572 | 0603 | |
| CG0603MLC-24LEA | BOURNS/伯恩斯 | 22+ | 5,000 | NA | |
| CG0603MLC-24LEA | BOURNS/伯恩斯 | 22+ | 158,000 | SMD0603 | |
| CG0603MLC-24LEA | BOURNS/伯恩斯 | 2026+ | 663,300 | 0603 | |
| CG0603MLC-24LEA | QDON/启迪半导体 | 25+ | 380,772 | 0603 | |
| CG0603MLC-24LEA | BOURNS/伯恩斯 | NEW | 2,400,000 | SMD0603 | |
| CG0603MLC-24LEA | BOURNS/伯恩斯 | 23+ | 205,000 | 0603N/AESD | |
| CG0603MLC-24LEA | BOURNS/伯恩斯 | 19+ | 30,000 | SMD | |
| CG0603MLC-24LEA | BOURNS/伯恩斯 | 2025+ | 180,000 | SMD | |
| CG0603MLC-24LEA | CNNPCHIP/新晶微 | 26+ | 335,600 | C0603 | |
| CG0603MLC-24LEA | BOURNS/伯恩斯 | 25+ | 435,600 | SMD | |
| CG0603MLC-24LEA | BOURNS/伯恩斯 | 26+ | 158,000 | SMD0603 | |
| CG0603MLC-24LEA | BOURNS/伯恩斯 | 1534 | 675,000 | SMD | |
| CG0603MLC-24LEA | BOURNS/伯恩斯 | 2025+ | 46,600 | N/A | |
| CG0603MLC-24LEA | EPCOS/爱普科斯 | 23+ | 900,000 | SMD | |
| CG0603MLC-24LEA | BOURNS/伯恩斯 | 2025+ | 300,000 | SMD |
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