Results for CGA0603MLC-12(27)
| Part Number | MFG | D/C | Stock | Package | Action |
|---|---|---|---|---|---|
| CGA0603MLC-12 | BOURNS/伯恩斯 | 2022+ | 52,300 | D0603 | |
| CGA0603MLC-12 | BOURNS/伯恩斯 | 2026+PB | 900,000 | D0603 | |
| CGA0603MLC-12 | LITESEMI/厉特 | 22+ | 30,000 | D0603 | |
| CGA0603MLC-12 | BOURNS/伯恩斯 | 23+ | 900,000 | D0603 | |
| CGA0603MLC-12 | ELECSUPER/静芯微 | 25+ | 123,000 | D0603 | |
| CGA0603MLC-12 | BOURNS/伯恩斯 | 23+ | 999,000 | D0603 | |
| CGA0603MLC-12E | CNNPCHIP/新晶微 | 26+ | 999,000 | C0603 | |
| CGA0603MLC-12E | BOURNS/伯恩斯 | 2022+ | 56,000 | 0603L | |
| CGA0603MLC-12E | BOURNS/伯恩斯 | 2026+ | 663,300 | 0603 | |
| CGA0603MLC-12E | BOURNS/伯恩斯 | 25+ | 435,600 | SMD | |
| CGA0603MLC-12E | BOURNS/伯恩斯 | 21+ | 15,000 | 0603 | |
| CGA0603MLC-12E | BOURNS/伯恩斯 | 26+ | 52,661 | C0603 | |
| CGA0603MLC-12E | XINGHEWEI | 25+ | 300,000 | C0603 | |
| CGA0603MLC-12E | BOURNS/伯恩斯 | 25+ | 100,000 | SMD | |
| CGA0603MLC-12E | BOURNS/伯恩斯 | 2024+ | 165,000 | N/A | |
| CGA0603MLC-12E | BOURNS/伯恩斯 | 2025+ | 200,000 | SMD | |
| CGA0603MLC-12E | BOURNS/伯恩斯 | 24+ | 88,000 | 0603 | |
| CGA0603MLC-12E | BOURNS/伯恩斯 | 25+ | 150,000 | SMD | |
| CGA0603MLC-12E | BOURNS/伯恩斯 | 26+ | 158,000 | SMD0603 | |
| CGA0603MLC-12E | BOURNS/伯恩斯 | 21+ | 15,000 | 0603 | |
| CGA0603MLC-12E | BOURNS/伯恩斯 | 22+ | 5,000 | NA | |
| CGA0603MLC-12E | BOURNS/伯恩斯 | 2025+ | 280,000 | SMD | |
| CGA0603MLC-12E | BOURNS/伯恩斯 | 22+ | 5,000 | SMD | |
| CGA0603MLC-12E | BOURNS/伯恩斯 | 26+ | 500 | SMD | |
| CGA0603MLC-12E | BOURNS/伯恩斯 | N/A | 9,320 | N/A | |
| CGA0603MLC-12E | BOURNS/伯恩斯 | 25+ | 89,080 | SMD | |
| CGA0603MLC-12E | BOURNS/伯恩斯 | 2016+ | 96,350 | SMD |
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