Results for CS0801SC12(18)
| Part Number | MFG | D/C | Stock | Package | Action |
|---|---|---|---|---|---|
| CS0801SC12 | SEMITEL/晶讯 | 24+PB | 1,000,000 | XX | |
| CS0801SC12 | TechN/APillar | 21+ | 90,892 | DFNN/A2L | |
| CS0801SC12 | TINYSEMI/台半科技 | 20+ | 850,000 | 0402 | |
| CS0801SC12 | SEMITEL/晶讯 | 24+PB | 1,000,000 | XX | |
| CS0801SC12 | ZXWILL | 2022+ | 52,300 | DFN1006 | |
| CS0801SC12 | SEMITEL/晶讯 | 2026+ | 663,300 | DFN1006N/A2L | |
| CS0801SC12 | SEMITEL/晶讯 | 24+PB | 1,000,000 | XX | |
| CS0801SC12 | LITESEMI/厉特 | 22+ | 30,000 | DFN1006 | |
| CS0801SC12 | XINGHEWEI | 25+ | 300,000 | DFN1006N/A2L | |
| CS0801SC12 | SEMITEL/晶讯 | 24+PB | 1,000,000 | XX | |
| CS0801SC12 | PLINGSEMIC/鹏领 | 23+ | 300,000 | DFN1006 | |
| CS0801SC12 | SEMITEL/晶讯 | 24+PB | 1,000,000 | XX | |
| CS0801SC12 | GMC | 16+PB | 1,100 | SMD | |
| CS0801SC12 | SXSEMIWD | 2026+PB | 900,000 | DFN1006 | |
| CS0801SC12 | TINYSEMI/台半科技 | 20+ | 850,000 | 402 | |
| CS0801SC12 | JGN/ASEMI/台湾金锆 | 25+ | 80,000 | SMD0201 | |
| CS0801SC12 | TINYSEMI/台半科技 | 24+ | 300,000 | 0402 | |
| CS0801SC12 | CNNPCHIP/新晶微 | 25+ | 900,000 | DFN1006N/A2L |
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