Results for ESDA0603-04(11)
| Part Number | MFG | D/C | Stock | Package | Action |
|---|---|---|---|---|---|
| ESDA0603-04 | JGN/ASEMI/台湾金锆 | 25+ | 83,121 | SMD0402 | |
| ESDA0603-04 | XINGHEWEI | 25+ | 300,000 | C0603 | |
| ESDA0603-04 | TW | 2025+ | 90,000 | SMD | |
| ESDA0603-04 | SXSEMIWD | 2026+PB | 900,000 | D0603 | |
| ESDA0603-04 | SEMITEH/胜敏特 | 2022+ | 40,000 | SMD0402 | |
| ESDA0603-04 | TW | 2025+ | 300,000 | SMD | |
| ESDA0603-04 | BORN/伯恩半导体 | 2026+ | 663,300 | 0603 | |
| ESDA0603-04 | BORN/伯恩半导体 | 2026+ | 236,600 | 0603 | |
| ESDA0603-04 | CNNPCHIP/新晶微 | 26+ | 999,000 | C0603 | |
| ESDA0603-04 | SUPN/ATECH | 17+ | 323,333 | SMD | |
| ESDA0603-04 | HKH | 2025+ | 320,000 | SMD |
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