Results for ESDLC3304P8(11)
| Part Number | MFG | D/C | Stock | Package | Action |
|---|---|---|---|---|---|
| ESDLC3304P8 | ZXWILL | 2022+ | 52,300 | DFN2626N/A10 | |
| ESDLC3304P8 | MCC/Cnnpchip/新晶微 | 26+ | 128,520 | DFN2626N/A10 | |
| ESDLC3304P8 | PLINGSEMIC/鹏领 | 23+ | 300,000 | DFN2626N/A10 | |
| ESDLC3304P8 | SXSEMIWD | 2026+PB | 900,000 | DFN2626N/A10 | |
| ESDLC3304P8 | MCC/美微科 | 22+ | 30,000 | DFN2626N/A10 | |
| ESDLC3304P8 | TSD/泰盛达 | 26+ | 30,000 | DFN2626N/A10 | |
| ESDLC3304P8 | TEN/AONG/拓能 | 2025+ | 1,803,000 | DFN2626N/A10 | |
| ESDLC3304P8 | TSD/泰盛达 | 26+ | 30,000 | DFN2626N/A10 | |
| ESDLC3304P8 | CNNPCHIP/新晶微 | 25+ | 900,000 | DFN2626N/A10 | |
| ESDLC3304P8 | MCC/美微科 | 25+ | 86,541 | DFN2626N/A1 | |
| ESDLC3304P8 | TSD/泰盛达 | 26+ | 30,000 | DFN2626N/A10 |
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