Results for ESDLC3V3D3-TP(30)
| Part Number | MFG | D/C | Stock | Package | Action |
|---|---|---|---|---|---|
| ESDLC3V3D3-TP | MCC/美微科 | 25+ | 114,520 | SOD323 | |
| ESDLC3V3D3-TP | MCC/美微科 | 24+ | 99,999 | SODN/A323 | |
| ESDLC3V3D3-TP | MCC/美微科 | 2026+ | 236,600 | SODN/A323 | |
| ESDLC3V3D3-TP | MCC/Cnnpchip/新晶微 | 26+ | 955,704 | SOD323 | |
| ESDLC3V3D3-TP | MXT/美芯台 | 26+ | 109,900 | SOD323 | |
| ESDLC3V3D3-TP | MCC/美微科 | 25+ | 125,800 | SODN/A323 | |
| ESDLC3V3D3-TP | MCC/美微科 | 25+ | 158,000 | SOD323 | |
| ESDLC3V3D3-TP | ELECSUPER/静芯微 | 25+ | 135,000 | SODN/A323 | |
| ESDLC3V3D3-TP | MCC/美微科 | 25+ | 60,000 | SODN/A323 | |
| ESDLC3V3D3-TP | MCC/美微科 | 25+PB | 92,584 | SODN/A323 | |
| ESDLC3V3D3-TP | MCC/美微科 | 2022+ | 53,200 | SODN/A323 | |
| ESDLC3V3D3-TP | XINGHEWEI | 25+ | 300,000 | SODN/A323 | |
| ESDLC3V3D3-TP | CNNPCHIP/新晶微 | 25+ | 900,000 | S0DN/A323 | |
| ESDLC3V3D3-TP | MCC/美微科 | 24+ | 68,750 | SOD323 | |
| ESDLC3V3D3-TP | MCC/美微科 | 21+ | 366,323 | SOD323 | |
| ESDLC3V3D3-TP | MCC/美微科 | 20+ | 116,000 | SODN/A323 | |
| ESDLC3V3D3-TP | MCC/美微科 | 2546+ | 83,500 | SOD323 | |
| ESDLC3V3D3-TP | MCC/美微科 | 2026+ | 663,300 | SODN/A323 | |
| ESDLC3V3D3-TP | MCC/美微科 | 25+PB | 89,128 | SODN/A323 | |
| ESDLC3V3D3-TP | MCC/美微科 | 25+ | 68,500 | SOD323 | |
| ESDLC3V3D3-TP | MCC/美微科 | 2023+ | 366,323 | SOD323 | |
| ESDLC3V3D3-TP | MCC/美微科 | 26+ | 324,100 | SODN/A323 | |
| ESDLC3V3D3-TP | CNNPCHIP/新晶微 | 26+ | 335,600 | SODN/A323 | |
| ESDLC3V3D3-TP | MCC/美微科 | 25+ | 23,100 | SOD323 | |
| ESDLC3V3D3-TP | TINYSEMI/台半科技 | 25+ | 75,468 | SODN/A323 | |
| ESDLC3V3D3-TP | MCC/美微科 | 26+ | 96,580 | SOD323 | |
| ESDLC3V3D3-TP | MCC/美微科 | 25+ | 83,121 | SODN/A323 | |
| ESDLC3V3D3-TP | MCC/美微科 | 25+ | 61,600 | SOD323 | |
| ESDLC3V3D3-TP | MicroCommercialCompONentsMCC | 26+ | 158,000 | SODN/A323N/A2 | |
| ESDLC3V3D3-TP | 国产 | 26+ | 86,203 | SOD323 |
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