Results for GBLC08C-N(30)
| Part Number | MFG | D/C | Stock | Package | Action |
|---|---|---|---|---|---|
| GBLC08C-N | BORN/伯恩半导体 | 25+ | 200,000 | SODN/A323 | |
| GBLC08C-N | JDT/集电通 | 25+ | 880,000 | SODN/A323 | |
| GBLC08C-N | BORN/伯恩半导体 | N/A | 5,000 | N/A | |
| GBLC08C-N | BORN伯恩 | 22+ | 38,350 | SODN/A323 | |
| GBLC08C-N | BORN/伯恩半导体 | 23+ | 3,000 | SODN/A323 | |
| GBLC08C-N | BORN/伯恩半导体 | 25+ | 16,955 | SODN/A323 | |
| GBLC08C-N | CNNPCHIP/新晶微 | 25+ | 900,000 | S0DN/A323 | |
| GBLC08C-N | BORN/伯恩半导体 | 2026+ | 663,300 | SODN/A323 | |
| GBLC08C-N | ELECSUPER/静芯微 | 25+ | 180,000 | SODN/A323 | |
| GBLC08C-N | ELECSUPER/静芯微 | 25+ | 15,000 | SODN/A323 | |
| GBLC08C-N | BORN/伯恩半导体 | 2026+ | 236,600 | SODN/A323 | |
| GBLC08C-N | BORN伯恩 | 25+ | 990,000 | SODN/A323 | |
| GBLC08C-N | BORN/伯恩半导体 | 26+ | 121,100 | SODN/A323 | |
| GBLC08C-N | JGN/ASEMI/台湾金锆 | 25+ | 80,000 | SODN/A323 | |
| GBLC08C-N | TINYSEMI/台半科技 | 24+ | 102,151 | SODN/A323 | |
| GBLC08C-N | HXY MOSFET华轩阳电子 | 25+ | 68,000 | SODN/A323 | |
| GBLC08C-N | SK/森浦科 | 24+ | 35,324 | SODN/A323 | |
| GBLC08C-N | TEN/AONG/拓能 | 2025+ | 1,803,000 | SODN/A323 | |
| GBLC08C-N | BORN伯恩 | 25+ | 97,636 | SODN/A323 | |
| GBLC08C-N | BORN/伯恩半导体 | 24+ | 69,000 | SODN/A323 | |
| GBLC08C-N | BORN伯恩 | 2022+ | 635,200 | SODN/A323 | |
| GBLC08C-N | BORN/伯恩半导体 | 2022+ | 53,200 | SODN/A323 | |
| GBLC08C-N | XINGHEWEI | 25+ | 300,000 | SODN/A323 | |
| GBLC08C-N | JDT/集电通 | 25+ | 880,000 | SODN/A323 | |
| GBLC08C-N | BOURNS/伯恩斯 | 22+ | 60,600 | SOD323 | |
| GBLC08C-N | BORN/伯恩半导体 | 25+ | 1,758 | SODN/A323 | |
| GBLC08C-N | BORN/伯恩半导体 | 25+ | 16,955 | SODN/A323 | |
| GBLC08C-N | BOURNS/伯恩斯 | 25+ | 46,000 | SOD323 | |
| GBLC08C-N | BORN/伯恩半导体 | 22+ | 936 | SODN/A323 | |
| GBLC08C-N | CNNPCHIP/新晶微 | 26+ | 354,455 | SODN/A323 |
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