Results for MDC300-16(13)
| Part Number | MFG | D/C | Stock | Package | Action |
|---|---|---|---|---|---|
| MDC300-16 | SILING/四菱 | 22+ | 1,210 | MODULE | |
| MDC300-16 | JFDIO/SEP | 25+ | 452,000 | DIP | |
| MDC300-16 | THCHBEN | 14+ | 57 | N/A | |
| MDC300-16 | DACO | 10+ROHS | 160 | N/A | |
| MDC300-16 | ASEMI/首芯 | 25 | 10,000 | MDC | |
| MDC300-16 | 申社 | N/A | 364 | MODULE | |
| MDC300-16 | SILING | 22+ | 1,210 | MODULE | |
| MDC300-16 | SILING/四菱 | 2024+ | 68 | Modules | |
| MDC300-16 | SILING/四菱 | 20+ | 146 | MODULE | |
| MDC300-16 | INFINEON/英飞凌 | 21 | 105 | N/A | |
| MDC300-16 | DACO SEMICONDUCTOR | 2026+ | 10,000 | N/A | |
| MDC300-16 | HYLC/华源联创 | 25+ | 5,000 | MODULE | |
| MDC300-16 | PERSEMI | 22+ | 28,000 | DIP |
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