Results for MDC55-18(7)
| Part Number | MFG | D/C | Stock | Package | Action |
|---|---|---|---|---|---|
| MDC55-18 | SILING | 22+ | 1,530 | MODULE | |
| MDC55-18 | TECHSEM | 19+ | 1,107 | MODULE | |
| MDC55-18 | ZV | 2026+ | 200 | M02 | |
| MDC55-18 | SILING/四菱 | 22+ | 1,530 | MODULE | |
| MDC55-18 | PERSEMI | 22+ | 28,000 | DIP | |
| MDC55-18 | JFDIO/SEP | 25+ | 452,000 | DIP | |
| MDC55-18 | HYLC/华源联创 | 25+ | 5,000 | MODULE |
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