Results for MDS300-18(9)
| Part Number | MFG | D/C | Stock | Package | Action |
|---|---|---|---|---|---|
| MDS300-18 | PERSEMI | 22+ | 28,000 | DIP | |
| MDS300-18 | SANREX/三社 | 2024+ | 210 | MODULE | |
| MDS300-18 | JFDIO/SEP | 25+ | 452,000 | DIP | |
| MDS300-18 | TECHSEM | 19+ | 1,050 | MODULE | |
| MDS300-18 | SILING | 22+ | 1,150 | MODULE | |
| MDS300-18 | HYLC/华源联创 | 25+ | 5,000 | MODULE | |
| MDS300-18 | WORWO | 20+ | 90 | N/A | |
| MDS300-18 | DACO SEMICONDUCTOR | 2026+ | 60,000 | M23 | |
| MDS300-18 | SILING/四菱 | 22+ | 1,150 | MODULE |
左右滑动查看更多信息