Results for MLVS0402L04(26)
| Part Number | MFG | D/C | Stock | Package | Action |
|---|---|---|---|---|---|
| MLVS0402L04 | INPAQ/佳邦 | 2026+ | 663,300 | 0402 | |
| MLVS0402L04 | INPAQ/佳邦 | 2026+ | 236,600 | 0402 | |
| MLVS0402L04 | INPAQ/佳邦 | 2025+ | 220,000 | SMD | |
| MLVS0402L04 | SXSEMIWD | 2026+PB | 900,000 | D0402 | |
| MLVS0402L04 | INPAQ/佳邦 | 1622 | 1,774 | N/A | |
| MLVS0402L04 | INPAQ/佳邦 | 2022+ | 40,000 | SMD | |
| MLVS0402L04 | INPAQ/佳邦 | 2025+ | 42,200 | N/A | |
| MLVS0402L04 | INPAQ/佳邦 | 2025+ | 200,000 | SMD | |
| MLVS0402L04 | CNNPCHIP/新晶微 | 26+ | 999,000 | D0402 | |
| MLVS0402L04 | QDON/启迪半导体 | 25+ | 381,162 | 0402 | |
| MLVS0402L04 | CNNPCHIP/新晶微 | 26+ | 335,600 | C0402 | |
| MLVS0402L04 | XINGHEWEI | 25+ | 300,000 | C0402 | |
| MLVS0402L04 | INPAQ/佳邦 | 22+ | 68,500 | SMD | |
| MLVS0402L04 | INPAQ/佳邦 | 2025+ | 183,000 | SMD | |
| MLVS0402L04 | INPAQ/佳邦 | 2019+ | 62,300 | SMD | |
| MLVS0402L04 | PLINGSEMIC/鹏领 | 23+ | 300,000 | D0402 | |
| MLVS0402L04M | INPAQ/佳邦 | 18+ | 10,000 | SMD | |
| MLVS0402L04M | CNNPCHIP/新晶微 | 26+ | 99,276 | C0402 | |
| MLVS0402L04M | INPAQ/佳邦 | 2026+ | 663,300 | 0402 | |
| MLVS0402L04M | INPAQ/佳邦 | 2026+ | 236,600 | 0402 | |
| MLVS0402L04M | INPAQ/佳邦 | 2025+ | 220,000 | SMD | |
| MLVS0402L04M | INPAQ/佳邦 | 2025+ | 200,000 | SMD | |
| MLVS0402L04M | INPAQ/佳邦 | 2025+ | 183,000 | SMD | |
| MLVS0402L04M | INPAQ/佳邦 | 26+ | 112,857 | C0402 | |
| MLVS0402L04M | INPAQ/佳邦 | 22+ | 68,500 | SMD | |
| MLVS0402L04M | XINGHEWEI | 25+ | 300,000 | C0402 |
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