Results for 55N03(814)
| Part Number | MFG | D/C | Stock | Package | Action |
|---|---|---|---|---|---|
| EMB55N03J | 杰力科技 | 2025+PB | 87,000 | SOTN/A23 | |
| EMB55N03J | EMC/杰力 | 22+ | 45,500 | SOTN/A23 | |
| EMB55N03J | EMC杰力 | 21+ | 363,000 | SOT23N/A3 | |
| EMB55N03J | EMC/杰力 | 25+ | 125,628 | SOTN/A23 | |
| EMB55N03J | EMC/杰力 | 23+ | 999,000 | SOTN/A23 | |
| EMB55N03J | EMC杰力 | 23+ | 128,900 | SOTN/A23 | |
| EMB55N03J | EMC杰力 | 21+ | 60,000 | SOTN/A23 | |
| EMB55N03J | EMC/杰力 | 24+ | 125,800 | SOTN/A23 | |
| EMB55N03J | EMC/杰力 | 2025+ | 122,556 | SOTN/A23 | |
| EMB55N03J | EMC杰力 | 24+ | 136,680 | SOTN/A23 | |
| EMB55N03J | EMC/杰力 | 26+ | 96,580 | SOTN/A23 | |
| FIR55N03G | FIRST/福斯特 | 23+ | 52,388 | TON/A220 | |
| FIR55N03G | FIRST/福斯特 | 24+15+ | 25,084 | TON/A220 | |
| FIR55N03G | FIRST/福斯特 | 2517+ | 79,999 | TON/A220 | |
| FIR55N03G | FIRST/福斯特 | 24+ | 38,658 | TON/A220 | |
| FIR55N03G | FIRST/福斯特 | 23+ | 33,226 | TON/A220 | |
| FIR55N03G | FIRST/福斯特 | 25+ | 50,000 | TON/A220 | |
| FIR55N03G | ONGIAMI安佳美 | 24+ | 2,000 | TON/A220 | |
| GJ55N03 | 昕晟微 | 22 | 100,000 | TO252TO251 | |
| GJ55N03 | GTM | 25+ | 68,500 | TO252 | |
| GJ55N03 | GTM | 1306+ | 2,112 | TO252 | |
| GJ55N03 | CTM | 06+ | 2,772 | TON/A252 | |
| GJ55N03 | CTM | 23+ | 52,388 | TON/A252 | |
| HRLD55N03K | SEMIHOW/韩国半导体 | 24+ | 38,658 | TON/A252 | |
| HRLD55N03K | 昕晟微 | 22 | 100,000 | TO252TO251 | |
| HRLD55N03K | SEMIHOW | 24+15+ | 24,355 | TON/A252 | |
| HRLD55N03K | SEMIHOW/韩国半导体 | 21+ | 66,666 | TON/A252 | |
| HRLD55N03K | SEMIHOW | 23+ | 52,388 | TON/A252 | |
| HRLD55N03K | HKZ/恒芯 | 23+ | 30,000 | DN/APAK | |
| HRLD55N03K | SEMIHOW | 2517+ | 79,999 | TON/A252 | |
| HRLD55N03K | Semihow | 19+ | 32,500 | TON/A252 | |
| HRLD55N03K | SEMIHOW | 25+ | 68,500 | TO252 | |
| HRLD55N03K | SEMIHOW/韩国半导体 | 25+ | 50,000 | TON/A252 | |
| HRLD55N03K | Semihow | 22+ | 50,000 | TON/A252 | |
| HRLD55N03K | SEMIHOW | 22+ | 65,252 | TON/A252 | |
| HRLD55N03K | SEMIHOW/韩国半导体 | 21+ | 12,730 | TON/A252 | |
| HRLD55N03K | Semihow | 22+ | 50,000 | TON/A252 | |
| HRLD55N03K | Semihow芯美浩微 | 19+ | 13,254 | TON/A252 | |
| HRLD55N03K | ONGIAMI安佳美 | 24+ | 50,000 | TON/A252 | |
| HRLD55N03K | SEMIHOW/韩国半导体 | 22+ | 43,231 | TON/A252 | |
| HRLD55N03K | SEMIHOW/韩国半导体 | 22+ | 48,755 | TON/A252 | |
| HRLF55N03K | SEMIHOW/韩国半导体 | 16+ | 3,000 | TON/A252 | |
| HRLF55N03K | JGN/ASEMI/台湾金锆 | 25+ | 80,000 | DFN5N/A6N/A8L | |
| HRLF55N03K | JGN/ASEMI/台湾金锆 | 25+ | 83,121 | DFN5X6_8L | |
| HRLF55N03K | HKZ/恒芯 | 23+ | 30,000 | 8DFN56 | |
| HRLF55N03K | TY/台灣半導体 | 2618+ | 30,348 | DFN5N/A6N/A8L | |
| HRLFS55N03K | JGN/ASEMI/台湾金锆 | 25+ | 83,121 | DFN3N/A3 | |
| HRLFS55N03K | SEMIHOW | 25+ | 68,500 | DFN3X3 | |
| HRLFS55N03K | JGN/ASEMI/台湾金锆 | 25+ | 80,000 | DFN3N/A3 | |
| HRLFS55N03K | HKZ/恒芯 | 23+ | 30,000 | 8DFN33 |
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