Results for CPDU5V0(154)
| Part Number | MFG | D/C | Stock | Package | Action |
|---|---|---|---|---|---|
| CPDU5V0U-HF | COMCHIP/典琦 | 25+ | 86,006 | 0603DFN1608 | |
| CPDU5V0U-HF | COMCHIP/典琦 | 26+ | 35,640 | N/A | |
| CPDU5V0U-HF | TEN/AONG/拓能 | 2025+ | 1,803,000 | SODN/A523F | |
| CPDU5V0U-HF | COMCHIP/典琦 | 1512+ | 18,000 | SOD523 | |
| CPDU5V0U-HF | COMCHIP/典琦 | 23+ | 900,000 | SOD523 | |
| CPDU5V0U-HF | COMCHIP/典琦 | 25+ | 83,121 | SODN/A523 | |
| CPDU5V0U-HF | COMCHIP/典琦 | 24+ | 57,000 | SODN/A523 | |
| CPDU5V0U-HF | COMCHIP/典琦 | 2024+PB | 36,250 | SODN/A523 | |
| CPDU5V0U-HF | COMCHIP/典琦 | 25+PB | 60,180 | SODN/A523 | |
| CPDU5V0U-HF | LITESEMI/厉特 | 22+ | 30,000 | SOD523 | |
| CPDU5V0U-HF | COMCHIP/典琦 | 25+PB | 97,580 | SODN/A523 | |
| CPDU5V0U-HF | COMCHIP/典琦 | 26+ | 36,254 | SOD523 | |
| CPDU5V0U-HF | COMCHIP/典琦 | 2019+ | 25,000 | 0603DFN1608 | |
| CPDU5V0U-HF | COMCHIP/典琦 | 24+15+ | 29,258 | SOD523 | |
| CPDU5V0U-HF | COMCHIP/典琦 | 2026+ | 663,300 | SOD523F | |
| CPDU5V0U-HF | ComchipTechnology | 26+ | 158,000 | SODN/A523N/A2 | |
| CPDU5V0U-HF | COMCHIP/典琦 | 2025+PB | 66,000 | SODN/A523 | |
| CPDU5V0U-HF | COMCHIP/典琦 | 2022+ | 53,200 | SOD523 | |
| CPDU5V0U-HF | COMCHIP/典琦 | 22+ | 158,000 | DFN1608 | |
| CPDU5V0U-HF | COMCHIP/典琦 | 25+ | 250,000 | SOD523 | |
| CPDU5V0U-HF | CNNPCHIP/新晶微 | 25+ | 900,000 | SODN/A523 | |
| CPDU5V0U-HF | XINGHEWEI | 25+ | 300,000 | SODN/A523F/0603 | |
| CPDU5V0U-HF | COMCHIP/典琦 | 2022+ | 52,300 | SOD523 | |
| CPDU5V0U-HF | Comchip/Cnnpchip/新晶微 | 26+ | 169,300 | SODN/A523 | |
| CPDU5V0U-HF | COMCHIP/典琦 | 23+ | 999,000 | SOD523 | |
| CPDU5V0U-HF | COMCHIP/典琦 | 2025+PB | 900,000 | SOD523 | |
| CPDU5V0U-HF | COMCHIP/典琦 | 24+ | 550,000 | SODN/A523 | |
| CPDU5V0USP-HF | COMCHIP/典琦 | 26+ | 36,251 | SOD523 | |
| CPDU5V0USP-HF | COMCHIP/典琦 | 22+ | 158,000 | DFN1608 | |
| CPDU5V0USP-HF | COMCHIP/典琦 | 2017+ | 9,000 | 0603SODN/A523F | |
| CPDU5V0USP-HF | Comchip/Cnnpchip/新晶微 | 26+ | 169,300 | SODN/A523 | |
| CPDU5V0USP-HF | COMCHIP/典琦 | 25+ | 30,000 | N/A | |
| CPDU5V0USP-HF | COMCHIP/典琦 | 2110+ | 4,000 | SODN/A523 | |
| CPDU5V0USP-HF | COMCHIP/典琦 | 2322+ | 1,300 | SOD523F | |
| CPDU5V0USP-HF | COMCHIP/典琦 | 2026+ | 236,600 | SODN/A523 | |
| CPDU5V0USP-HF | COMCHIP/典琦 | 2022+ | 52,300 | SOD523 | |
| CPDU5V0USP-HF | COMCHIP/典琦 | 2025+PB | 66,000 | 0603SODN/A523F | |
| CPDU5V0USP-HF | COMCHIP/典琦 | 23+ | 999,000 | SOD523 | |
| CPDU5V0USP-HF | COMCHIP/典琦 | 2322+ | 1,300 | SOD523F | |
| CPDU5V0USP-HF | JGN/ASEMI/台湾金锆 | 25+ | 36,000 | SODN/A523F | |
| CPDU5V0USP-HF | COMCHIP/典琦 | 25+ | 86,002 | 0603DFN1608 | |
| CPDU5V0USP-HF | COMCHIP/典琦 | 2025+PB | 15,000 | SODN/A523F | |
| CPDU5V0USP-HF | ComchipTechnology | 26+ | 158,000 | SODN/A523N/A2 | |
| CPDU5V0USP-HF | COMCHIP/典琦 | 2522+ | 57,535 | N/A | |
| CPDU5V0USP-HF | SK/森浦科 | 24+ | 32,802 | 0603SODN/A523F | |
| CPDU5V0USP-HF | COMCHIP/典琦 | 2019+ | 25,000 | 0603DFN1608 | |
| CPDU5V0USP-HF | COMCHIP/典琦 | 23+ | 900,000 | SOD523 | |
| CPDU5V0USP-HF | COMCHIP/典琦 | 2026+PB | 900,000 | SOD523 | |
| CPDU5V0USP-HF | XINGHEWEI | 25+ | 300,000 | SODN/A523F/0603 | |
| CPDU5V0USP-HF | LITESEMI/厉特 | 22+ | 30,000 | SOD523 |
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