Results for ESD3Z24(112)
| Part Number | MFG | D/C | Stock | Package | Action |
|---|---|---|---|---|---|
| ESD3Z24 | Cnnpchip/RS | 26+ | 999,000 | SODN/A323 | |
| ESD3Z24 | XN/APRYZ/芯湃半导体 | 2025+ | 300,000 | DFN1006N/A2 | |
| ESD3Z24 | FORMOSAMS | 25+ | 83,121 | SODN/A323F | |
| ESD3Z24 | YFW/佑风微 | 25+ | 30,000 | SODN/A323 | |
| ESD3Z24 | MS | 23+ | 900,000 | SOD323 | |
| ESD3Z24 | MS | 2022+ | 52,300 | SOD323 | |
| ESD3Z24 | XINGHEWEI | 25+ | 300,000 | SODN/A323 | |
| ESD3Z24 | LEIDITECH/雷卯电子 | 2026+ | 236,600 | SODN/A323 | |
| ESD3Z24 | CRK/辰瑞克 | 26+ | 50,000 | SODN/A323 | |
| ESD3Z24 | ELECSUPER/静芯微 | 25+ | 33,000 | SOD323 | |
| ESD3Z24 | TINYSEMI/台半科技 | 25+ | 117,481 | SODN/A323 | |
| ESD3Z24 | LEIDITECH/雷卯电子 | 2026+ | 663,300 | SOD323 | |
| ESD3Z24 | FMS/美丽微 | 24+ | 30,000 | SODN/A323F | |
| ESD3Z24 | JGN/ASEMI/台湾金锆 | 25+ | 80,000 | SODN/A323 | |
| ESD3Z24 | QDON/启迪半导体 | 25+ | 371,751 | SODN/A323 | |
| ESD3Z24 | MS | 23+ | 999,000 | SOD323 | |
| ESD3Z24 | CNNPCHIP/新晶微 | 26+ | 335,600 | SOD323 | |
| ESD3Z24 | CNNPCHIP/新晶微 | 25+ | 900,000 | S0DN/A323 | |
| ESD3Z24 | 篮彩 | 25+ | 180,000 | SOD323 | |
| ESD3Z24 | MS | 2026+PB | 900,000 | SOD323 | |
| ESD3Z24 | FORMOSAMS | 24+ | 40,000 | SODN/A323F | |
| ESD3Z24BWS | WENETE/韦能特 | 25+ | 120,000 | SOD323 | |
| ESD3Z24BWS | LITESEMI/厉特半导体 | 23+ | 999,000 | SOD323 | |
| ESD3Z24BWS | QDON/启迪半导体 | 25+ | 369,595 | SODN/A323 | |
| ESD3Z24BWS | PLINGSEMIC/鹏领 | 23+ | 300,000 | SOD323 | |
| ESD3Z24BWS | ZXWILL | 2022+ | 52,300 | SOD323 | |
| ESD3Z24BWS | MSV/萌盛微 | 25+ | 500,000 | SOD323 | |
| ESD3Z24BWS | SXSEMIWD | 2026+PB | 900,000 | SOD323 | |
| ESD3Z24BWS | TINYSEMI/台半科技 | 25+ | 152,532 | SODN/A323 | |
| ESD3Z24BWS | topdynamic | 26+ | 158,000 | SODN/A323 | |
| ESD3Z24C | ELECSUPER/静芯微 | 25+ | 30,000 | SOD323 | |
| ESD3Z24C | QDON/启迪半导体 | 25+ | 370,207 | SODN/A323 | |
| ESD3Z24C | ANBON/台湾安邦 | 25+ | 3,033 | SODN/A323 | |
| ESD3Z24C | TINYSEMI/台半科技 | 24+ | 119,717 | SODN/A323 | |
| ESD3Z24C | ANBON/台湾安邦 | 26+ | 500 | SODN/A323 | |
| ESD3Z24C | FMS/美丽微 | 24+ | 30,000 | SODN/A323F | |
| ESD3Z24C | ANBON/台湾安邦 | 26+ | 500 | SODN/A323 | |
| ESD3Z24C | ANBON/台湾安邦 | 25+ | 180,000 | SODN/A323 | |
| ESD3Z24C | MSV/萌盛 | 25+ | 500,000 | SOD323 | |
| ESD3Z24C | LEIDITECH/雷卯电子 | 2026+ | 663,300 | SOD323 | |
| ESD3Z24C | MS | 2022+ | 52,300 | SOD323 | |
| ESD3Z24C | MS | 2026+PB | 900,000 | SOD323 | |
| ESD3Z24C | Formosams/Cnnpchip/新晶微 | 26+ | 121,059 | SODN/A323 | |
| ESD3Z24C | MS | 23+ | 999,000 | SOD323 | |
| ESD3Z24C | LEIDITECH/雷卯电子 | 2026+ | 236,600 | SODN/A323 | |
| ESD3Z24C | XINGHEWEI | 25+ | 300,000 | SODN/A323 | |
| ESD3Z24C | JGN/ASEMI/台湾金锆 | 25+ | 80,000 | SODN/A323 | |
| ESD3Z24C | FORMOSAMS | 25+ | 98,650 | SODN/A323 | |
| ESD3Z24C | 矽润 | 26+ | 3,654,000 | SOD323 | |
| ESD3Z24C | CITC/竹懋 | 2025+ | 145,000 | SODN/A323 |
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