Results for NE5532(756)
| Part Number | MFG | D/C | Stock | Package | Action |
|---|---|---|---|---|---|
| NE5532AFE | 小S/大S | 18+ | 880 | CDIPN/A8 | |
| NE5532AFE | PHILIPS/飞利浦 | 21+22+ | 34 | CDIPN/A8 | |
| NE5532AFE | PHILIPS/飞利浦 | 19+ | 684 | DIP | |
| NE5532AFE | S/PHI | 94 | 55 | CDIP8 | |
| NE5532AFE | S | N/A | 1,050 | DIP | |
| NE5532AFE | PHILIPS/飞利浦 | 93+ | 50 | DIPN/A8 | |
| NE5532AFE | PHILIPS/飞利浦 | 23+ | 30 | CDIP8 | |
| NE5532AFE | PHILIPS/飞利浦 | 23+ | 867 | PDIP8 | |
| NE5532AFE | S/PHI | 94 | 55 | CDIP8 | |
| NE5532AFE | 回收此料IC | 1231+ | 1 | CDIP8 | |
| NE5532AFE | PHILIPS/飞利浦 | 96+ | 2 | DIP | |
| NE5532AFE | PHILIPS/飞利浦 | 19+ | 684 | DIP | |
| NE5532AFE | PHIN | N/A | 62 | CDIP8 | |
| NE5532AIP | TI/德州仪器 | 23+ | 50,000 | DIP | |
| NE5532AIP | TI/德州仪器 | 22+ | 3,200 | DIP8 | |
| NE5532AIP | TI/德州仪器 | 23+ | 50,000 | DIP | |
| NE5532AIP | TI/德州仪器 | 24+ | 50,000 | DIP | |
| NE5532AIP | TI/德州仪器 | 24+ | 83,036,663 | SOPDIP | |
| NE5532AN | NXP/恩智浦 | 23+ | 50,000 | DIP | |
| NE5532AN | NXP/恩智浦 | 23+ | 50,000 | DIP | |
| NE5532AN | NXP/恩智浦 | 24+ | 50,000 | DIP | |
| NE5532AN | PHILIPS/飞利浦 | 21+ | 5,000 | DIP8 | |
| NE5532AN | N/A | 15+ | 5,200 | N/A | |
| NE5532AN | PHILIPS/NXP/S/NXP/S | 21+ | 6,447 | PDIP8 | |
| NE5532AN | NXP/恩智浦 | 26+ | 5,282 | DIP8 | |
| NE5532AN | NXP/恩智浦 | 24+ | 15,000 | DIP8 | |
| NE5532AN | NXP/恩智浦 | 12+ | 12,586 | DIP8 | |
| NE5532AN | PHILIPS/飞利浦 | 18+ | 52,000 | DIPN/A8 | |
| NE5532AN | NXP/恩智浦 | 23+ | 50,000 | DIP | |
| NE5532AN | TUDI/钍地 | 26+ | 75,980 | DIP8 | |
| NE5532AN | NXP/恩智浦 | 26+ | 58,699 | DIP8 | |
| NE5532AN | NXP/恩智浦 | 21+ | 5,282 | DIP8 | |
| NE5532AN | PHILIPS/飞利浦 | 2208+ | 10,121 | DIP8 | |
| NE5532AN | ONSEMI/安森美 | 2017 | 78,900 | DIP | |
| NE5532AN | NXP/恩智浦 | 23+ | 50,000 | DIP | |
| NE5532AN | TUDI/钍地 | 26+ | 75,980 | DIP8 | |
| NE5532AN | ONSEMI/安森美 | 22+ | 18,500 | DIP8 | |
| NE5532AN | PHILIPS/飞利浦 | N/A | 20,504 | DIP8 | |
| NE5532AN | ONSEMI/安森美 | 2023+ | 30,000 | PDIP8 | |
| NE5532AN | NXP/恩智浦 | 24+ | 15,000 | DIP8 | |
| NE5532AN | PHILIPS/飞利浦 | 23+ | 9,855 | DIPN/A8 | |
| NE5532AN | NXP/恩智浦 | 23+ | 999,000 | DIP8 | |
| NE5532AN | TUDI/钍地 | 26+ | 75,980 | DIP8 | |
| NE5532AN | TUDI/钍地 | 26+ | 75,980 | DIP8 | |
| NE5532AN | ONSEMI/安森美 | 2017 | 78,900 | DIP | |
| NE5532AN | TUDI/钍地 | 26+ | 75,980 | DIP8 | |
| NE5532AN | NXP/恩智浦 | 2018 | 99,998 | DIPN/A8 | |
| NE5532AN | TUDI/钍地 | 26+ | 75,980 | DIP8 | |
| NE5532ANG | ONSEMI/安森美 | 2026+ | 4,225 | DIP/SOP | |
| NE5532ANG | COSINE/科山芯创 | 22+ | 3,000 | DIP8 |
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