Results for SD12C(346)
| Part Number | MFG | D/C | Stock | Package | Action |
|---|---|---|---|---|---|
| SESD12C | SEMIWARE/赛米微尔 | 26+ | 50,000 | SMD | |
| SESD12C | PLINGSEMIC/鹏领 | 25+ | 300,000 | SOD323 | |
| SESD12C | CNNPCHIP/新晶微 | 26+ | 121,599 | SODN/A323 | |
| SESD12C | LITESEMI/厉特半导体 | 23+ | 999,000 | SOD323 | |
| SESD12C | CNNPCHIP/新晶微 | 25+ | 900,000 | S0DN/A323 | |
| SESD12C | SEMIWARE/赛米微尔 | 25+ | 83,121 | SODN/A323 | |
| SESD12C | QDON/启迪半导体 | 25+ | 364,562 | SODN/A323 | |
| SESD12C | XINGHEWEI | 25+ | 300,000 | SODN/A323 | |
| SESD12C | PLINGSEMIC/鹏领 | 23+ | 300,000 | SOD323 | |
| SESD12C | SEMIWARE/赛米微尔 | 26+ | 158,000 | SODN/A323 | |
| SESD12C | SEMIWARE/赛米微尔 | 2026+ | 663,300 | SODN/A323 | |
| SESD12C | SEMIWARE/赛米微尔 | 2022+ | 53,200 | SODN/A323 | |
| SESD12C | SXSEMIWD | 2026+PB | 900,000 | SOD323 | |
| SESD12C | HXY MOSFET华轩阳电子 | 25+ | 68,000 | SODN/A323 | |
| SESD12C | MSV/萌盛微 | 26+ | 500,000 | SOD323 | |
| SSD12C | SENCHIP | 25+ | 65,850 | SODN/A323 | |
| SSD12C | SENCHIP | 2025+PB | 15,000 | SOD323 | |
| SSD12C | SENCHIP | 24+ | 72,000 | SODN/A323 | |
| SSD12C | Senchip/Cnnpchip/新晶微 | 26+ | 954,498 | SODN/A323 | |
| SSD12C | SENCHIP | 2022+ | 52,300 | SOD323 | |
| SSD12C | SINEDEVICE/宇宏微 | 25+ | 88,000 | SODN/A323 | |
| SSD12C | SENCHIP | 23+ | 900,000 | SOD323 | |
| SSD12C | SENCHIP | 2026+ | 236,600 | SODN/A323 | |
| SSD12C | ELECSUPER/静芯微 | 25+ | 33,000 | SOD323 | |
| SSD12C | SENCHIP | 2026+ | 663,300 | SOD323 | |
| SSD12C | Senchip | 2025+PB | 900,000 | SOD323 | |
| SSD12C | Senchip | 26+ | 119,198 | SOD323 | |
| SSD12C | CNNPCHIP/新晶微 | 25+ | 900,000 | S0DN/A323 | |
| SSD12C | SK/森浦科 | 24+ | 41,572 | SODN/A323 | |
| SSD12C | XINGHEWEI | 25+ | 300,000 | SODN/A323 | |
| SSD12C | SENCHIP | 23+ | 999,000 | SOD323 | |
| TESD12CU | CNNPCHIP/新晶微 | 26+ | 335,600 | DFN1006 | |
| TESD12CU | PLINGSEMIC/鹏领 | 23+ | 300,000 | DFN1006 | |
| TESD12CU | ZXWILL | 2022+ | 52,300 | DFN1006 | |
| TESD12CU | SPSEMI/瞬雷 | 2022+ | 100,000 | DFN10060402 | |
| TESD12CU | SPSEMI/瞬雷 | 23+ | 8,187 | DFN10060402 | |
| TESD12CU | SPSEMI/瞬雷 | 2026+ | 236,600 | DFN1006N/A2L | |
| TESD12CU | CNNPCHIP/新晶微 | 25+ | 900,000 | DFN1006N/A2L | |
| TESD12CU | SXSEMIWD | 2026+PB | 900,000 | DFN1006 | |
| TESD12CU | QNMICRO/全能微 | 25+ | 89,500 | DFN1006N/A2 | |
| TESD12CU | XINGHEWEI | 25+ | 300,000 | DFN1006N/A2L | |
| TESD12CU | LITESEMI/厉特半导体 | 23+ | 999,000 | DFN1006 | |
| TESD12CU | SPSEMI/瞬雷 | 2026+ | 663,300 | DFN1006N/A2L | |
| TESD12CU | LITESEMI/厉特 | 22+ | 30,000 | DFN1006 | |
| TESD12CU | PLINGSEMIC/鹏领 | 25+ | 300,000 | DFN1006 | |
| TESD12CU | QDON/启迪半导体 | 25+ | 370,692 | DFN1006 |
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